INFiLED has unveiled its groundbreaking ColdLED technology, a result of years of dedicated research and development. This innovative technology is designed to address the heat-related challenges commonly associated with LED screens.
ColdLED technology incorporates several key techniques: utilizing the flip-chip method, incorporating common cathode technology, applying high-quality ICs, and employing a well-designed PCB layout design.
In traditional face-up LED assembly (Left image), chips are connected to contact points via copper or gold wires. However, these wires can hinder the brightness of LEDs, leading to reduced luminous efficiency. Additionally, the small contact area between the chip and circuit board results in decreased LED heat dissipation, leading to elevated screen temperatures.
Conversely, flip-chip assembly (Right image) involves mounting LED chips and integrated circuits directly onto the substrate. This direct connection leads to shorter wire connections without impeding luminous efficiency, resulting in a more compact design with a larger heat radiating area. As a result, flip-chip assembly enables better heat dissipation and improved thermal performance.
The core component of an LED display screen is individual light-emitting diodes, which exhibit forward conduction characteristics. Conventional displays typically use a common anode method (Image-1) for illumination, leading to power wastage and increased heat generation due to the different voltages required for R LED (1.8-2.0V) and G LED & B LED (3.0-3.3V) illumination.
In contrast, ColdLED technology utilizes a common cathode approach (Image-2) to achieve energy savings. This method separates the power supply for R, G, and B, accurately distributing voltage and current to the red, green, and blue LEDs. By reducing voltage loss and significantly lowering the temperature of the display screen, this approach enhances energy efficiency.
To ensure reliability, INFiLED employs top-of-the-line driver ICs in the production of LED screens featuring ColdLED technology. The company utilizes 60nm ICs with higher precision, surpassing the industry standard of 880nm-120nm. This choice results in lower power consumption and reduced screen temperatures during operation. Additionally, the integration of row-column driving aids in the precision and coordination of LED control while reducing IR drop to a certain extent.
The PCB board features a well-planned and balanced circuit design to ensure optimal circuit performance and heat dissipation, thereby reducing the operating temperature of the screen. The PCB layout includes a complete reference plane, which effectively reduces impedance between line and improves heat dissipation efficiency.
Furthermore, INFiLED has also invested in and co-developed power supplies with a remarkable 92% power efficiency, surpassing the conventional range of 85-88%, which will further decrease heat generation.
With the adoption of ColdLED technology, INFiLED achieves a cool and touchable surface for displays, ensuring an enjoyable viewing experience. The technology also provides thermal pattern relief, maintaining stable light wavelength and luminous efficiency, thus preserving superior display performance during extended operation. Moreover, the reduced screen temperature protects the LEDs, contributing to a stable and longer lifespan for the components and the screen.
In conclusion, ColdLED technology represents a significant leap forward in LED screen innovation, addressing heating concerns while delivering exceptional performance and reliability. It underscores INFiLED’s commitment to sustainability and environmental protection by leveraging advanced technological processes, high-quality materials, and thoughtful design principles to set a new standard for LED display technology, promising an enhanced user experience.
